Dab tsi yog cov khoom tseem ceeb uas yuav tsum tau rau txhuas ntawv siv siv ua catrede cov neeg sau khoom tam sim no?
Aluminium ntawv yuav tsum muaj ultra-siab huv (ntau dua los yog sib npaug ntawm 99.6%) kom txo qis hluav taws xob. Nws yuav tsum tau kho tuab (feem ntau {{{{} μm) nrog kev thev taus tsawg dua lossis sib npaug}. Qhov saum npoo yuav tsum tau tswj roughness (ra 0. {{}. 3μm) kom txhim kho cov khoom nplaum. Cov cuab yeej kho tshuab zoo li tensile lub zog ({{{} mpa mpa) thiab elongation (ntau dua lossis sib npaug rau kev tsim cov txheej txheem. Ib qho ntxiv, cov ntawv ci yuav tsum tsim cov txheej txheem oxide ruaj khov ({}}}}}}}}}}}} vs. li \/ li + + li \/ lis +).
2. Yuav ua li cas lub microstructure ntawm txhuas ntawv cuam tshuam cuam tshuam kev ua haujlwm roj teeb?
Ib lub qauv grain ({{{20-50 μm lis loj loj) ua kom muaj zog sib xws thiab txheej nplaum nplaum. Nyiam crystallographic cov kev paub (piv txwv li, (100) kev ntxhib los mos) tuaj yeem txhim kho kev coj ua los ntawm {%. Intermetallic hais (fe \/ al theem) yuav tsum tau finely dispersed kom tsis txhob muaj corrosioncon. Recrystallization Thaum annealing yuav tsum tshem tawm cov khoom siv tsis xws luag uas ua rau pinholes. Cov neeg tsim khoom tau tam sim no siv hluav taws xob rov qab qhov txawv (EBSD) los ua kom ua kom zoo rau cov qauv micrittructural.
3. Dab tsi cov kev kho mob saum npoo av tau siv rau cov cathode txhuas ntawv ci?
Plasma Pluas tshem tawm cov paug organic ua ntej txheej kom txhim kho qhov chaw tsis huv. Electrochemical etching tsim micro-pits ({{}}} μm} μm} μm} μm} μm inter intering្ inter mechanical້ນ nrog rau hluav taws xob. Qee cov neeg tsim khoom siv cov pa roj carbon tsho (50-200 nm) kom txo cov kev cuam tshuam tsis kam. Hydrophilic tshuaj kho mob txhim kho slurry dispersion nyob rau txheej. Laser nto Texturing ({{4 4}} μm qauv) yog tawm los ua kev kho mob ib txwm muaj rau ib qho kev kho mob ib txwm muaj.
4. Cov txheej txheem ntau lawm sib txawv rau roj teeb-qib vs. ntim-qeb txhuas ntawv?
Cov roj teeb cov khoom siv roj teeb sab nraud tswj kev ua kom huv ntawm kev tswj hwm nrog lub tshuab nqus tsev ntxiv thaum lub sijhawm ua. Dov tau ua nyob rau hauv chav kawm 1000 cov tshuab nqus kom tiv thaiv kom muaj kev paug. Intermediate annealing kub ({300-400 degree) yog qhov zoo rau cov recrystallization yam tsis muaj kev loj hlob ntau dhau. Thaum Kawg Txias Txias Rolling Txo (Ntau dua los yog sib npaug rau 80%) ua tiav cov thinness thaum tswj lub zog. Kev soj ntsuam zoo yog xws li cov tswv yim siab xws li X-me ntsis Fluorescence (XRF) rau kev txheeb xyuas.
5. Dab tsi yog qhov kev sib tw tseem ceeb hauv kev txhim kho cov neeg txuas ntxiv ntawm cov catho cov ntawv ci?
Achieving ≤8μm thickness without compromising mechanical stability during electrode processing. Reducing foil resistance while maintaining corrosion resistance for >4.5v daim ntawv thov. Kev txhim kho kev siv cov txheej txheem kev siv ntau lawm siv cov rov ua dua qub yam tsis muaj kev ua tau zoo. Kev sib xyaw ua ke cov xim ceev uas tus kheej saib xyuas cov ntawv ci degradation. Scaling ntau lawm kom tau raws li terawatt-teev kev thov thaum khaws cov nqi qis dua $ {4}}. 8 \/ m².
